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| Metal Oxide Varistors SMD multilayer varistor with Ni-barrier termination CT0603L25HSG B72500T8250L060 Designation system CT 0603 L 25 HS G = Chip with three-layer- termination (Ag/Ni/Sn) = Dimensions of the device 06 x 03 (length x width in 1/100 inch) = Tolerance of the varistor voltage ( 15%) = Maximum operating voltage (RMS voltage) = Designed for protection of high speed data lines = Taped version (cardboard tape, 7" reel, 4000 pieces/reel) Figure l b l = 1.6 0.15 b = 0.8 0.10 s = 0.9 max. k = 0.1 - 0.4 s k (all dimensions in mm) As far as patents or other rights of third parties are concerned, liability is only assumed for components per se, not for applications, processes and circuits implemented within components or assemblies. The information describes the type of component and shall not be considered as assured characteristics. Terms of delivery and rights to change design reserved. ISSUE DATE 28.01.2005 ISSUE f PUBLISHER KB VS PE PAGE 1/7 Metal Oxide Varistors SMD multilayer varistor with Ni-barrier termination CT0603L25HSG B72500T8250L060 V-I-characteristic 400 V v 200 VAR9737A 100 80 60 40 20 10 8 6 4 2 1 10 -5 10 -4 10 -3 10 -2 10 -1 10 0 i A 10 1 Max. current, energy, operating voltage and average power dissipation depending on ambient temperature % 100 90 80 70 60 50 40 30 20 10 0 -55 70 80 90 100 110 120 Ambient temperature 130 140 150 C ISSUE DATE 28.01.2005 ISSUE f PUBLISHER KB VS PE PAGE 2/7 Metal Oxide Varistors SMD multilayer varistor with Ni-barrier termination CT0603L25HSG B72500T8250L060 Electrical data Maximum operating voltage RMS voltage DC voltage VRMS = 25 V VDC = 32 V Varistor voltage (@ 1 mA) VV = 51.9 up to 70.1 V Maximum clamping voltage (@ 1 A) VC = 120 V Maximum surge current (8/20 s) Imax = 1 x 5 A Maximum energy absorption (ESD) Emax = 50 mJ (@ ESD according to ISO TR10605, 25 kV air discharge, 150 pF, 2 k) Capacitance (@ 1 MHz, 1 V, 25 C, typ.) Response time Operating temperature Storage temperature (mounted parts) C = 10 pF < 0.5 ns -40 ... +125 C -40 ... +150 C Termination material Ag/Ni/Sn (thickness not specified, adjusted to fulfil wettability specification according to IEC 60068-2-58) Complies with following ESD standards: IEC 61000-4-2 level 4 (8 kV contact, 15 kV air discharge) ISO TR10605 level 4 (25 kV air discharge) AEC Q200 002 level 6 (25 kV air discharge) ISSUE DATE 28.01.2005 ISSUE f PUBLISHER KB VS PE PAGE 3/7 Metal Oxide Varistors SMD multilayer varistor with Ni-barrier termination CT0603L25HSG B72500T8250L060 Stability to multiple ESD pulses1) 80 60 40 20 0 0 1 10 100 1000 10000 number of ESD pulses 1) 15 kV air discharge, 150 pF, 330 , according to IEC 61000-4-2 Signal insertion loss2) 0.00 -0.50 insertion loss [dB] -1.00 -1.50 -2.00 -2.50 -3.00 0 20 40 60 80 100 frequency [MHz] 2) typical values, measured with network analyzer HP8753 E/S containing S-parameter test set ISSUE DATE 28.01.2005 ISSUE f PUBLISHER KB VS PE PAGE 4/7 Metal Oxide Varistors SMD multilayer varistor with Ni-barrier termination CT0603L25HSG B72500T8250L060 Recommended geometry of solder pad B A D C B A = 1.0 mm B = 1.0 mm C = 1.0 mm E = 3.0 mm A Recommended soldering temperature profile Soldering zone max. 7 s at max. temp. Preheating zone max. 2 C/s 300 C T 245 215 180 100 s Cooling-down zone max. 2 C/s (natural air cooling) 40 s Soldering zone max. 5 s at max. temp. 10 s Preheating zone max. 2 C/s 300 C T 260 235 200 1st solder wave Cooling-down zone max. 5 C/s (natural air cooling) 2nd solder wave 130 100 100 20 0 50 100 150 200 s t VAR0543-W-E 20 250 0 50 100 150 200 s t 250 VAR0550-F-E This component should be soldered within 12 months after delivery from EPCOS. They should be left in their original packings to avoid soldering problems due to oxidized terminals. Storage temperature: -25 to 45 C Relative humidity: < 75% annual average, < 95% on maximum 30 days in a year. The usage of mild non-activated fluxes for soldering is recommended, as well as proper cleaning of the PCB. The components are suited for Pb-free soldering. ISSUE DATE 28.01.2005 ISSUE f PUBLISHER KB VS PE PAGE 5/7 Metal Oxide Varistors SMD multilayer varistor with Ni-barrier termination CT0603L25HSG B72500T8250L060 Taping according to IEC 60286-3 Tape material: cardboard T D 0 P 2 P 0 Tape end (trailer) E 40 min. empty cavities Leader F B 0 T 1 T T 2 1 A 0 P 1 G W Direction of unreeling 25 min. empty cavities 300 mm cover tape Dimensions and tolerances: Definition Compartment width Compartment length Sprocket hole diameter Sprocket hole pitch Distance center hole to center compartment Pitch of the component compartments Tape width Distance edge to center of hole Distance center hole to center compartment Distance compartment to edge Thickness of cardboard tape Overall thickness 1) Symbol A0 B0 D0 P0 P2 P1 W E F G T T2 Dimension [mm] 0.95 1.8 1.5 4.0 2.0 4.0 8.0 1.75 3.5 0.75 0.9 1.1 Tolerance [mm] 0.2 0.2 0.1 0.1 1) 0.05 0.1 0.3 0.1 0.05 min. max. max. 0.2 mm over any 10 pitches ISSUE DATE 28.01.2005 ISSUE f PUBLISHER KB VS PE PAGE 6/7 Metal Oxide Varistors SMD multilayer varistor with Ni-barrier termination CT0603L25HSG B72500T8250L060 Packing Reel material: plastic Packing unit: 4000 pcs./reel Reel dimensions: Definition Reel diameter Reel width (inside) Reel width (outside) Symbol A W1 W2 Dimension [mm] 180 8.4 14.4 Tolerance [mm] +0/ -3 +1.5/ -0 max. O EPCOS AG 2005. Reproduction, publication and dissemination of this data sheet, enclosures hereto and the information contained therein without EPCOS' prior express consent is prohibited. Purchase orders are subject to the General Conditions for the Supply of Products and Services of the Electrical and Electronics Industry recommended by the ZVEI (German Electrical and Electronic Manufacturers' Association), unless otherwise agreed. ISSUE DATE 28.01.2005 ISSUE f PUBLISHER KB VS PE PAGE 7/7 |
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